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Precautions
(7) Handling after soldering
a) Do not tilt, bend or twist the FPCAP after it has been soldered on the PC board.
b) Do not use the FPCAP as a handle to move the PC board after it has been attached to it.
c) Do not bump the FPCAP with objects after it has been soldered to the PC board. Make sure the FPCAP does not touch
other PC boards or components.
d) Do not subject to excessive stress after it has been soldered to the PC board.
(8) Washing the PC board
Check the following items before washing the PC board with these detergents; high quality alcohol-based cleaning fluid such as
Pine- α ST-100S, Clean-thru 750H, 750L, 750K, or Techno Care FRW14 through 17; or detergents including substitute
Freon such as AK-225AES and IPA.
a) Use immersion or ultrasonic wave to clean for a total of less than five minutes.
b) The temperature of the cleaning fluid should be less than 60 ° C.
c) Watch for contamination of the detergent (conductivity, pH, specific gravity, water content, etc.).
d) After cleaning do not store in a location subject to gases from the cleaning fluid or in an airtight container.
Dry the PC board and the FPCAP using hot air (less than the maximum operating temperature).
e) Please contact our company for details about detergents and cleaning methods, and about detergents other than those
listed above.
(9) Fixatives and coatings
a) Select appropriate material for the FPCAP marking material and sealant.
In particular, make sure the fixative, coating and thinner do not contain acetone or toluene.
b) Before applying a fixative or coating, completely remove any flux residue and foreign matter from the area where the PC board
and the FPCAP are to be joined together.
c) Allow any detergent to dry before applying the fixative or coating.
d) Please contact our company for fixative and coating heat curing conditions.
3. Precautions with completed board
(1) Do not directly touch the FPCAP terminals.
(2) Do not use electric conductors to cause a short circuit between the FPCAP terminals.
Do not subject the FPCAP to conductive solutions.
(3) Check the installation environment of the board on which the FPCAP is mounted.
(4) Aging of the completed board, please use the voltage below the rated voltage of the capacitor.
(5) It is recommended that the board be used at room temperature and in ordinary humidity.
For details, refer to the Operating Precaution Guidelines for the EIAJ RCR-2367C. (Safety Application Guide for fixed
aluminum electrolytic capacitors for use in electronic equipment.)
No part of this publication shall be reproduced without prior written permission of the publisher.
4. If trouble should occur
(1) In the event that a short circuit causes the current to become relatively small (Radial lead type : less than approximately
3A for φ 10 and less than approximately 1A for φ 6.3), the FPCAP itself will generate some heat, but the appearance
will not be affected even when electricity is supplied continuously. However, if there is a short circuit and the current value
exceeds the above mentioned values, the temperature inside the FPCAP will increase.
When the temperature exceeds approximately 200 ° C the internal pressure will increase, and an odorous gas will be released.
In this case, do not allow contact with your face and hands.
(2) If a short circuit occurs and an odorous gas is released, either turn off the device’s main power or unplug the power cord from
the outlet.
(3) If a short circuit should occur, it may take anywhere from a few seconds to a few minutes until an odorous gas develops,
depending on the conditions. Design the device so that a power protection circuit works during this time period.
4
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
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